Senior Director, Packaging and Reliability Quality
Company: Micron Technology
Location: Boise
Posted on: March 10, 2026
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Job Description:
Micron Technology is a world leader in innovating memory and
storage solutions that accelerate the transformation of information
into intelligence, inspiring the world to learn, communicate and
advance faster than ever. As the Senior Director, the leader of the
Package Quality & Reliability organization is responsible for
delivering best-in-class package quality and reliability
performance for all Micron products, including component DRAM and
NAND, DIMM, HBM, MCP, and SSD. The three main responsibilities are:
• Closely partnering with the Advanced Package Technology
Development and Package Development Engineering organizations to
identify new and unique quality and reliability challenges,
including chip-to-package interactions, and ensuring they are
addressed during the design and development phase of the product
life cycle. • Executing package reliability qualification and
ongoing package quality and reliability monitoring in
manufacturing. Driving continuous improvement in package
reliability test coverage with an understanding of varying use
conditions. • Managing the Global Quality package reliability lab
operations around the globe. Other Responsibilities: • Build an
effective team with subject matter experts and optimize department
performance and structure. • As the subject matter expert in
Package Quality & Reliability for the Global Quality organization,
this team is expected to provide risk assessment recommendations
for new package qualifications, package and assembly manufacturing
change qualifications, and support customer communication as
needed. • Establish organizational roadmaps and strategies to drive
long term vision for the organization. • Ensure team members are
properly trained according to department compliance and work
requirements • Manage internal budgets including capex optimization
for package qualification sites for various product Candidate
Profile: • You must have at least 20 years of proven experience in
high-value/high-volume semiconductor packaging/assembly engineering
and/or manufacturing, with at least 10 years in a global leadership
role. • You should have substantial experience and/or knowledge in
managing large-scale global organizations, with a consistent track
record of leading high-performing teams. • Excellent communication
and interpersonal skills, with the ability to work effectively at
all levels, are essential. Micron offers the benefits of a work
environment that is stimulating, challenging and balanced; where
personal & professional accomplishment, growth and excellence are a
key driver. You will be working in a people management role within
an established organization; and being part of an employee centric
business that provides a large degree of autonomy to their
management team and encourages creativity and development of new
ideas. As a world leader in the semiconductor industry, Micron is
dedicated to your personal wellbeing and professional growth.
Micron benefits are designed to help you stay well, provide peace
of mind and help you prepare for the future. We offer a choice of
medical, dental and vision plans in all locations enabling team
members to select the plans that best meet their family healthcare
needs and budget. Micron also provides benefit programs that help
protect your income if you are unable to work due to illness or
injury, and paid family leave. Additionally, Micron benefits
include a robust paid time-off program and paid holidays. For
additional information regarding the Benefit programs available,
please see the Benefits Guide posted on
micron.com/careers/benefits.
Keywords: Micron Technology, Meridian , Senior Director, Packaging and Reliability Quality, Manufacturing , Boise, Idaho
